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Bambu PCProduct Features Exceptional Thermal Resistance Excellent Mechanical Properties High Impact Strength and Durability Suitable for Engineering Purpose Comes with High Temperature Reusable Spool Diameter: 1. 75mm + 0. 03mm AMS Compatible Enclosure Printers Required Dry out before use Bambu PC Bambu PC is a filament known for its exceptional strength, dimensional stability, and clarity. Ideal for functional parts and prototypes that require a balance of

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product description

Why choose thelockerguy wholesale?

Product Features

Exceptional Thermal Resistance
Excellent Mechanical Properties
High Impact Strength and Durability
Suitable for Engineering Purpose
Comes with High Temperature Reusable Spool
Diameter: 1.75mm +/- 0.03mm
AMS Compatible
Enclosure Printers Required
Dry out before use

Bambu PC

Bambu PC is a filament known for its exceptional strength, dimensional stability, and clarity. Ideal for functional parts and prototypes that require a balance of toughness and visual appeal.

Parameters Comparison

	ABS	ASA	PC
Composition	acrylonitrile - butadiene - styrene	acrylonitrile - styrene - acrylate	Polycarbonate
Hotend Compatibility	All Size/Material
Build Plate Compatibility	Engineering Plate, High Temperature Plate, Textuerd PEI Plate
AMS Compatibility	Yes	Yes	Yes
Glue	Bambu Liqud Glue/Glue Stick	Bambu Liqud Glue/Glue Stick	Glue Stick
Dry Out Before Use	Recommended	Recommended	Required
Odor During Printing	Pungent odor	Relatively lighter pungent odor	Light phenol-flavored odor
Toughness (Impact Strength - XY)	39.3 kJ/m²	41.0 kJ/m²	34.8 kJ/m²
Strength (Bending Strength - XY)	62 MPa	65 MPa	108 MPa
Stiffness (Bending Modulus - XY)	1880 MPa	1920 MPa	2310 MPa
Layer Adhesion (Impact Strength - Z)	7.4 kJ/m²	4.9 kJ/m²	9.0 kJ/m²
Heat Resistant（HDT, 0.45 MPa）	87 ℃	100 ℃	117 ℃
Saturated Water Absorption Rate / % (25 °C，55% RH)	0.65%	0.45%	0.25%

RFID for Intelligent Printing

All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System). Load and print! No more tedious setting steps.

Accessory Compatibility

	Recommended	Not Recommended
Build Plate	Engineering Plate, High Temperature Plate or Textured PEI Plate	Cool Plate
Hotend	All Size / Material	/
Glue	Glue Stick	Bambu Liquid Glue

Recommended Printing Settings		Physical Properties		Mechanical Properties
Drying Settings (Blast Drying Oven)	80 °C，8 h	Density	1.20 g/cm³	Tensile Strength	55 ± 4 MPa
Printing and Keeping Container's Humidity	< 20% RH (Sealed, with Desiccant)	Vicat Softening Temperature	119 °C	Breaking Elongation Rate	3.8 ± 0.3 %
Nozzle Temperature	260 - 280 °C	Heat Deflection Temperature	117 °C	Bending Modulus	2310 ± 70 MPa
Bed Temperature (with Glue)	90 - 110 °C	Melting Temperature	228 °C	Bending Strength	108 ± 4 MPa
Printing Speed	< 300 mm/s	Melt Index	32.2 ± 2.9 g/10 min	Impact Strength	34.8 ± 2.1 kJ/m²

Downloads

Filament TDS

Filament MSDS

Filament RoHS

Printing Tips

Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.

• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.