The T400 supports Intel LGA1700, LGA115X (1150/1151/1155/1156), and LGA1200, as well as AMD AM4 and AM5. Mounting hardware for all listed platforms is included. Confirm your specific socket is listed before ordering.

Chamber Pressurization Technology uses an enclosed shroud structure around the fan and fin stack to create a sealed airflow chamber. Instead of allowing air to escape around the heatsink edges, the shroud focuses the fan’s static pressure directly through the fin array — concentrating airflow across the heatpipes and fin surfaces for improved heat dissipation efficiency.

The T400 uses a 5V 3-Pin ARGB connector, compatible with ASUS Aura Sync, MSI Mystic Light, Gigabyte RGB Fusion, and other 5V ARGB ecosystems. Do NOT connect to a 12V RGB header — incorrect voltage will immediately and permanently damage the ARGB circuit. Check your motherboard’s header label before connecting.

With 4 direct-contact 6mm copper heatpipes and a dual-tower fin stack measuring 127 × 104 × 148mm, the T400 is generally suitable for mainstream to upper-mainstream desktop CPUs with a TDP up to approximately 130W–150W at stock speeds. For CPUs with a TDP above 150W or heavily overclocked configurations, a larger cooler or liquid cooling solution is recommended.

The 120mm PWM fan operates at up to 2200 RPM with a noise level of 28.6 dBA at maximum speed. At lower PWM-controlled speeds during light workloads, noise is generally well below 20 dBA. The hydraulic bearing design reduces bearing noise compared to sleeve bearing fans.

HDT (Heat-pipe Direct Touch) means the four 6mm copper heatpipes make direct contact with the CPU heat spreader, without an intermediate base plate. This reduces thermal resistance at the contact point and allows heat to transfer into the fin stack more quickly. The base is precision-milled flat to maximize contact area with the CPU lid.

The T400 measures 127 × 104 × 148mm (approximately 5.0" × 4.1" × 5.8") in height, not including mounting hardware. Most standard mid-tower ATX cases support CPU coolers up to 155–165mm in height, so this cooler generally fits with adequate clearance. For compact Micro-ATX or Mini-ITX cases, check your case’s maximum CPU cooler height specification before ordering.

The dual-tower fin stack uses 0.4mm thick aluminum fins spaced 2mm apart. Stamped turbulence notches on each fin disrupt the boundary layer of airflow through the fin channels, creating small turbulent eddies that improve heat transfer between the fin surface and passing air. This increases effective cooling surface area utilization without requiring additional fin density or a larger heatsink footprint.