The KT-27 supports Intel LGA115X sockets only: LGA1150, LGA1151, LGA1155, and LGA1156. It uses a 75 × 75mm backplate mounting pattern. It is not compatible with Intel LGA1700, LGA1200, or any AMD socket (AM4, AM5, etc.). Confirm your motherboard socket before ordering.

The KT-27 measures 88 × 88 × 27mm (approximately 3.46" × 3.46" × 1.06") in total height, not including the backplate. At 27mm, it is specifically designed for HTPC cases and 1U server chassis that require low-profile CPU coolers. Check your case’s maximum CPU cooler height specification to confirm fit before ordering.

The KT-27 is designed for mainstream Intel LGA115X processors including Intel Core i3, i5, Celeron, and Pentium series. It is generally suitable for CPUs with a TDP up to approximately 65W at stock speeds. For higher-TDP processors or overclocked configurations, a larger cooler is recommended.

The 80mm fan operates at up to 2500 RPM ±10% with a noise level of 25 dBA ±10%. At lower PWM-controlled speeds, noise is generally well below 20 dBA. The hydraulic bearing design reduces bearing noise compared to sleeve bearing fans, making this cooler suitable for quiet HTPC environments.

The KT-27 includes a backplate mounting kit for Intel LGA115X (75 × 75mm hole pattern). Please confirm whether thermal paste is included in the package before installation — if not included, apply a pea-sized amount of thermal compound to the CPU heat spreader before mounting the cooler.

The fan uses a 4-pin PWM (small 4-pin) connector, allowing your motherboard to automatically adjust fan speed between idle and 2500 RPM based on CPU temperature. This is compatible with standard 4-pin PWM headers on all major Intel platform motherboards.

Standard tower coolers typically measure 130–165mm in height, which is incompatible with HTPC cases, 1U server chassis, and slim mini-ITX enclosures. A low-profile cooler like the KT-27 at 27mm fits within these space-constrained environments while still providing active PWM-controlled cooling. If your build uses a standard mid-tower case, a taller tower cooler will generally offer better thermal performance for the same CPU.

The KT-27 uses a copper-core insert embedded in the aluminum base plate. Copper has approximately 4× higher thermal conductivity than aluminum, so the copper core rapidly draws heat away from the CPU heat spreader and transfers it into the surrounding aluminum fin structure. This hybrid design improves heat dissipation compared to a pure aluminum base — particularly important in a low-profile cooler where fin surface area is limited by height constraints.