The KT-19 supports Intel LGA 115X (1151/1150/1155/1156) and LGA 1200 via the 75×75 mm backplate variant, and Intel LGA 1700 (12th/13th/14th Gen Core) via the 78×78 mm backplate variant. Select the correct option above before adding to cart. It is not compatible with AMD AM4/AM5 or Intel LGA 2011/2066 platforms.

Check your motherboard's socket specification. If it lists LGA 1151, 1150, 1155, 1156, or LGA 1200, select the 115X/1200 (75×75) variant. If it lists LGA 1700 (used by Intel 12th, 13th, and 14th Gen Core processors), select the 1700 (78×78) variant. When in doubt, check your motherboard manual or the manufacturer's product page.

The cooler body is 19 mm tall (≈0.75 inches), measured from the base plate to the top of the fan — backplate thickness is not included in this figure. This profile is specifically engineered for HTPC enclosures and 1U server chassis. Always verify your case's maximum CPU cooler height clearance before purchasing; some ultra-compact cases may have tolerances tighter than 19 mm above the socket.

The 4-pin PWM fan runs between 1,000 and 3,200 RPM, with noise ranging from approximately 11 dB(A) at low speed to 28 dB(A) at full speed. Because it uses a standard PWM signal, your motherboard's BIOS fan curve will automatically adjust speed based on CPU temperature — so in typical desktop workloads the fan generally stays in the quieter lower range.

The full-copper construction (fins + base + dual heat pipes) gives the KT-19 strong thermal transfer for its size class. It is generally suitable for Intel CPUs with a TDP up to approximately 65 W in a case with reasonable airflow. For processors with higher TDP ratings or in sealed enclosures with limited ventilation, additional case fans or a different cooler solution may be needed.

Please refer to the product images for the full package contents. If thermal compound is not pre-applied or included, any standard CPU thermal paste (such as MX-4, NT-H1, or equivalent) is compatible with the copper base plate. A thin, even application across the CPU heat spreader is recommended for best results.

Copper has roughly 60% higher thermal conductivity than aluminum (≈385 W/m·K vs. ≈205 W/m·K). In a low-profile cooler where fin surface area is limited by height constraints, using copper throughout the fin stack, base, and heat pipes helps compensate for the reduced surface area — typically resulting in lower CPU temperatures compared to aluminum coolers of the same physical size.

Yes — the 19 mm body height is specifically cited by the manufacturer as meeting HTPC and 1U chassis height requirements. That said, always confirm your chassis's exact CPU cooler clearance, as some 1U enclosures have proprietary mounting rails or airflow baffles that may affect fitment. The standard 4-pin PWM connector is compatible with most server-grade Intel motherboards that provide a CPU_FAN header.